The department was formerly known as Chemical and Materials Engineering and changed to Semiconductor Engineering in the 112th academic year. Its goal is to develop students with professional knowledge and skills in semiconductor manufacturing, packaging, and testing. It also aims to develop the professional and practical abilities required by the semiconductor industry. The main focuses of core technologies are power semiconductor components, processes and materials, and IC packaging and testing. The research includes chemical and material applications, semiconductor component manufacturing, packaging and testing, and intelligent production lines. Students can identify, analyze, and solve real-world semiconductor technology issues with innovation and creativity by developing independent learning habits and abilities.
- Focus on the research and application of specialized technologies in semiconductor component coating technology (plasma application technology, nano-ceramic, and glass sintering technology), optoelectronic semiconductor materials, surface treatment, semiconductor process technology, packaging and testing technology, power component testing, etc.
- Focus on improving students' English skills and international perspective, assist them in obtaining professional certificates and motivate them to be innovative and creative.
Semiconductor Device Process Center; Power Semiconductor Module Packaging and Testing Industrial Environment Factory; Semiconductor and Ceramic Materials Laboratory; Powder Technology Laboratory; Micro-Nano Technology Service Center; Material Processing and Surface Treatment Laboratory; Electronic and Optoelectronic Materials Technology Laboratory and Precision Instrument Center.