Introduction

In response to the high-speed transmission processing requirements for colossal data volume in the 5G era, various transmission interface technologies are also evolving toward higher performance specifications. Thus industry-related technicians are in high demand. Approved by the Ministry of Education, the university received a subsidy of NT$ 100 millions for developing a “High-Speed Electronic Transmission Interface Packaging Design and Testing Talent Training and Technology Center” in 2022.

Two existing “industrial elite training and demonstration” bases have laid the foundation for the development of “High-Speed Electronic Transmission Interface Packaging Design and Testing Talent Training and Technology Center,” including a “3D-Digital Circuit Board Design and Intelligent Manufacturing Production Line Factory” and a “(5G) Mobile Communication Module Testing and Tuning Industrial Environment Factory.” Both factories have established practical technology and R&D capacities to design and test high-speed transmission interface electronic packaging, set up electronic assembly layouts, designs, testing research and development, verification, and other related laboratories. Academic programs and partner-school seed teacher training supplement the factories and labs. Together they have formed a technical guidance team to assist in industrial upgrading and to cultivate students’ professional ability to fully dock with the development of the national electronics industry and become practical technicians of Taiwan’s electronics industry.